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| Index | Abbreviation | Description | Category | Mark |
| 3 | 3GPP | 3rd Generation Partnership Project | HW | The original scope of 3GPP was to produce globally applicable Technical Specifications and Technical Reports for a 3rd Generation Mobile System based on evolved GSM core networks and the radio access technologies that they support both Frequency Division Duplex (FDD) and Time Division Duplex (TDD) modes). http://www.3gpp.org/ |
| A | AC | Architecture | PM | |
| A | APEMA | Asia Pacific Middle East and Australia | M&S | It is one of marketing area used by Philips. |
| A | ART | Accelerated Reliability Test | MD | |
| A | ASE | Architecture & System Engineering | CECW | |
| A | AVL | Approve Vendor List | S&M | |
| B | B&W | Black & White. | HW | It is for LCD type, such as B/W, 4K color, 65K color etc. |
| B | BABT | British Approvals Board of Telecommunication | HW | http://www.babt.com/ |
| B | BCA | Business Case Analysis | M&S | |
| B | BER | Bit Error Rate | HW | It is one of key RF parameter and test items online. |
| B | BOM | Bill Of Material | TOP | |
| C | CAS Form | Component Approval Submission Form | QA | It is for CECW ONLY. In Philips, CAS means Customer Approval Sample, which is expressed in qty. |
| C | CB | Contract Book | PM | |
| C | CD | Component Damage | TOP | Items of defect description, incoming material issue. |
| C | CDMA | Code Division Multiple Access | HW | |
| C | CE | Communaute Europeenne (French) | HW | It is French and used even by English literature now (means European community). CE mark/certification is necessary for mobile phone sales in European retail/operator channel, which include EMC, SAR and Safety. |
| C | CMCC | China Mobile Communications Corporation | ALL | http://www.chinamobile.com/ |
| C | COB | Chip On Board | HW | LCD IC bonding process, include COG, COF, TAB, COB, SMT etc |
| C | COF | Chip On Film | HW | LCD IC bonding process, include COG, COF, TAB, COB, SMT etc |
| C | COG | Chip On Glass | HW | LCD IC bonding process, include COG, COF, TAB, COB, SMT etc |
| C | CR | Change Request | M&S | It is for CECW ONLY. In Cellon France, it is named CRF (Change Request Form) and there is a database of all CRF kept by key Account Manager. |
| C | CRR | Component Review Report | QA | The document is to approve that a customized part can fully meet CECW's print/specification and component implied requirements. |
| C | CS | Cold Solder | TOP | Items of defect description, SMT process issue. |
| C | CSN | Concession | ALL | In agile, we use CSN to replace LSR. |
| C | CSTN | Color Supertwist Nematic | HW | LCD technology |
| C | CTA | China Type Approval | HW | |
| D | DAF | Drawing/Specification Agreement Form | QA | |
| D | DCN | Design Change Notice | ALL | Initially, DCN is the design change information before SA while ECO is the one after SA, which using in CECW ONLY. Now CECW have implemented Agile (PLM system) and unified DCN & ECO to ECO. Surely, some CECW old project still follow DCN now. |
| D | DDD | Detail Design Document | SW | |
| D | DFM | Design For Manufacture | TOP | |
| D | DOE | Design of Experiment | ALL | Engineer Statistical method |
| D | DP | Damage Part | TOP | Items of defect description. it is visual material issue caused by production instead of incoming. |
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